Hi, all

I plan to use SU-8 as a adhesive media to bong a glass cover on a SU-8
patterned substrate. I read a paper which introduced their work using
a dummy wafer to spin on SU-8, then attach the substrate with pattern
on on this dummy wafer, and detach. After this, a thin layer of SU-8
will leave on the pattern which could be used as adhesive media to
bond with a cover using pressure&heating method.

I am afraid the SU-8 will fill in my SU-8 pattern microchannel during
the bonding. and another problem is that I am not sure that there will
be uniform SU-8 layer left on the pattern as I think the attach and
detach process is too hard to be performed. So, does anybody has such
experience to share and give some instruction on the critical steps or
parameters .

Thanks in advance!

Steven