Hello Steven,

Try these papers:
Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8
Sheng Li et al 2003 J. Micromech. Microeng. 13 732-738
doi:10.1088/0960-1317/13/5/328

Rapid MEMS Prototyping using SU-8, Wafer Bonding and Deep Reactive Ion Etching
(do a web search and you should able to find this one.

The method you describe is over complicated, these papers will get you in the
right direction.

Brad Johnson
Sales Application Engineer
DJK Global
US Distributor, Semiconductor Inspection Systems
2447 W. 12th St. - Suite 6, Tempe, AZ 85281
480-968-3343 Ext 112 office
602-501-4413 cell
[email protected]
http://www.djksemi.com


-----Original Message-----
From: Steven Yang [mailto:[email protected]]
Sent: Tuesday, February 12, 2008 8:36 AM
To: mems-talk
Subject: [mems-talk] How to use SU-8 for adhesive bonding?

Hi, all

I plan to use SU-8 as a adhesive media to bong a glass cover on a SU-8
patterned substrate. I read a paper which introduced their work using
a dummy wafer to spin on SU-8, then attach the substrate with pattern
on on this dummy wafer, and detach. After this, a thin layer of SU-8
will leave on the pattern which could be used as adhesive media to
bond with a cover using pressure&heating method.

I am afraid the SU-8 will fill in my SU-8 pattern microchannel during
the bonding. and another problem is that I am not sure that there will
be uniform SU-8 layer left on the pattern as I think the attach and
detach process is too hard to be performed. So, does anybody has such
experience to share and give some instruction on the critical steps or
parameters .

Thanks in advance!

Steven