Hi All,

I am looking for a something in the way of a sealant to protect Al bond
pads on a silicon wafer from being attacked in NaOH/H2O2 etch.
The sealant should be low/non-outgassing, low (<80degC) cure temp, low
viscosity and easily and completely removable with domestic chemicals
(acetone, tetrachloroethylene etc).

I'll be grateful for any recommendations, even if they don't meet all
the specs above. I am currently using Dow Corning DC282, but it is not
wholly resistant to the NaOH.

Many Thanks,
Darren.

SELEX Sensors and Airborne Systems Limited