Dear all,

I am fabricating SU8 molds on silicon wafer. The humidity is not well
controlled in our fab. When it is below 20% percent, the adhesion is good.
However, I find the effect of dehydration bake is very limited when the
humidity is above 30%. I think the moisture condensed to the surface
immediately after I take the wafer off the hotplate. I don't know what's
the humidity when other people fabricating the SU8 mold. I am wondering
whether anybody have any success in such humidity.

I am thinking of using AP300 as adhesion promoter between silicon wafer
and SU-8 molds. I see we had a lot of discussion here before. Could
someone give me a standard operation procedure to start with? Thanks!

Regards,

Peng