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MEMSnet Home: MEMS-Talk: Hf resistant Adhesion layer for Au on Si
Hf resistant Adhesion layer for Au on Si
2008-04-03
Heiko Prüßner
2008-04-03
Morrison, Richard H., Jr.
2008-04-03
Ruiz, Marcos Daniel (SENCOE)
2008-04-03
Brent Garber
2008-04-04
Michael Larsson
2008-04-09
Heiko Prüßner
2008-04-09
Shay Kaplan
2008-04-09
Jesse D Fowler
Hf resistant Adhesion layer for Au on Si
Morrison, Richard H., Jr.
2008-04-03
Cr and gold mix at temperatures >150c so you should try Ti or TiW.

Rick

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Heiko Prüßner
Sent: Thursday, April 03, 2008 5:42 AM
To: General MEMS discussion
Subject: [mems-talk] Hf resistant Adhesion layer for Au on Si

Dear all,

I had a 20nmCr/ 200nmAu film sputtert on silicon. This setup has been treated at
350°C for an hour. At the final Hf etching step which I used to remove the
BOX of an SOI wafer the Au film peeled of.

Does anybody have an explanation? Do I need a diffusion barrier between the Cr
and the Au? Or has anyone a suggestion for another adhesion layer?
reply
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