We sputter coated 100 mn Cr adhesion layer onto glass wafer.
Using same device, we sputter 500 nm Au layer, directly to Cr.
Then we using spin coater make the final photoresist layer.
After developing, we try to etch gold layer, using TFA ( KI : I2 : H2O,
4:1:40),
but after few seconds, Au layer starts peeling away from the Cr.
Instead of etching, we wash Au layer out.
Can you help us, how to etch Au with desired pattern?

thank you.