Also, Cr/Au combination doesn't like iodine-based etch.
Try lift-off if applicable, or replace Cr with Ti.


--On Thursday, April 10, 2008 4:46 PM Shay Kaplan  wrote:

> You must not break the vacuum between Cr and gold
> deposition Shay
>
> -----Original Message-----
> From: [email protected]
> [mailto:[email protected]] On Behalf Of Petra
> Juskov?
> Sent: Thursday, April 10, 2008 3:55 PM
> To: [email protected]
> Subject: [mems-talk] Au peeling away from Cr adhesion
> layer
>
> We sputter coated 100 mn Cr adhesion layer onto glass
> wafer. Using same device, we sputter 500 nm Au layer,
> directly to Cr. Then we using spin coater make the final
> photoresist layer. After developing, we try to etch gold
> layer, using TFA ( KI : I2 : H2O, 4:1:40), but after few
> seconds, Au layer starts peeling away from the Cr.
> Instead of etching, we wash Au layer out.
> Can you help us, how to etch Au with desired pattern?