....or use Aqua Regia (HNO3:HCl:DIW = 3:1:3) to etch the gold since it
will not attack the chrome.

Dan

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Erkin Seker
Sent: Thursday, April 10, 2008 7:59 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Au peeling away from Cr adhesion layer

Also, Cr/Au combination doesn't like iodine-based etch.
Try lift-off if applicable, or replace Cr with Ti.


--On Thursday, April 10, 2008 4:46 PM Shay Kaplan 
wrote:

> You must not break the vacuum between Cr and gold deposition Shay
>
> -----Original Message-----
> From: [email protected]
> [mailto:[email protected]] On Behalf Of Petra Juskov?
> Sent: Thursday, April 10, 2008 3:55 PM
> To: [email protected]
> Subject: [mems-talk] Au peeling away from Cr adhesion layer
>
> We sputter coated 100 mn Cr adhesion layer onto glass wafer. Using
> same device, we sputter 500 nm Au layer, directly to Cr. Then we using

> spin coater make the final photoresist layer. After developing, we try

> to etch gold layer, using TFA ( KI : I2 : H2O, 4:1:40), but after few
> seconds, Au layer starts peeling away from the Cr.
> Instead of etching, we wash Au layer out.
> Can you help us, how to etch Au with desired pattern?
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