Another option is to use either an ion mill, or a plasma etcher with just
argon and the power cranked up high.

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Erkin Seker
Sent: Thursday, April 10, 2008 10:59 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Au peeling away from Cr adhesion layer

Also, Cr/Au combination doesn't like iodine-based etch.
Try lift-off if applicable, or replace Cr with Ti.


--On Thursday, April 10, 2008 4:46 PM Shay Kaplan  wrote:

> You must not break the vacuum between Cr and gold
> deposition Shay
>
> -----Original Message-----
> From: [email protected]
> [mailto:[email protected]] On Behalf Of Petra
> Juskov?
> Sent: Thursday, April 10, 2008 3:55 PM
> To: [email protected]
> Subject: [mems-talk] Au peeling away from Cr adhesion
> layer
>
> We sputter coated 100 mn Cr adhesion layer onto glass
> wafer. Using same device, we sputter 500 nm Au layer,
> directly to Cr. Then we using spin coater make the final
> photoresist layer. After developing, we try to etch gold
> layer, using TFA ( KI : I2 : H2O, 4:1:40), but after few
> seconds, Au layer starts peeling away from the Cr.
> Instead of etching, we wash Au layer out.
> Can you help us, how to etch Au with desired pattern?
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk