We use just the same process in our lab.
Did you sputter Au right after Cr? How 's the surface condition of the Au layer?
Then which potoresist do you use?
In our lab we spin AZ5214E on to the substrate with Cr and Au sputtered, and
use AZ300MIF to develop it. Finally we use gold etchant (KI:I2:H2O=4:1:80)
to etch. We seldom came across with failure in this process.

On Thu, Apr 10, 2008 at 11:59 PM, David Nemeth 
wrote:
> Another option is to use either an ion mill, or a plasma etcher with just
> argon and the power cranked up high.
>

--
ZHANG Yu, Aaron
MPhil Candidate,
Centre for Micro and Nano Systems,
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong.