Good evening,

I have a problem when depositing the membrane TiW used for RF MEMS Switch.
We use sputtering for the deposition and TiW is deposited over a thin film of
PMMA.
After the deposition the photo resist is all cracked.
I don't know if the temperature is too hot or the pressure we use is not
suitable.

Can anybody give me some advice?

Thank you.

Kim-Anh BUI-THI

Stagiaire de Thalès Recherche et Technologie
91767 - Palaiseau Cedex
Portable : + 33 6 37 955 998