Hello, all,

I found this abstract about the electroforming directly on the nickel plate,
anyone knows other papers on this? What's the con. of this method?

Thank you.

Micro Hot Embossing Metal Mold For Microfluidic Chip Based On No Back Plate
Growing Method
Liqun Du; Chong Liu; Haijun Liu; Jiang Qin; Yuanjie Wei
Nano/Micro Engineered and Molecular Systems, 2006. NEMS apos;06. 1st IEEE
International Conference on
Volume , Issue , 18-21 Jan. 2006 Page(s):101 - 104
Digital Object Identifier   10.1109/NEMS.2006.334648
Summary:This paper presents a novel microfabrication technology of micro hot
embossing metal mold - no back plate growing method. Micro metal mold is
fabricated by low-cost UV-LIGA surface micro fabrication process using negative
thick photoresist, SU-8. Different from other micro hot embossing molds, the
micro mold with vertical sidewalls is fabricated by micro nickel electroforming
directly on nickel substrate. Because of no back plate growing demand, time of
nickel electroforming decrease greatly. This takes advantages not only short
produce cycle and low cost, but also high precision of micro mold. Based on the
micro nickel mold and automation fabrication system, high precision and mass-
producing microfluidic chips have been fabricated. Uniformity of width and
height of micro mold is discussed. Thermal expansion and swelling of SU-8
structure at high temperature and at room temperature have also been
investigated in the paper. From the experiment
 results of thermal expansion and swelling, it can be seen that thermal
expansion of SU-8 structure affects the width of micro mold after nickel
electroforming considerably