Colleagues,

I'd like to  perform Au electroplating. For particular PVD reasons I cannot
provide  an Au-seed layer.
Since Cu forms an alloy with Au I was wondering weather it is feasible to
electroplate Au onto Cu.
Since I'm cautious with Gold I was wondering if you could provide me  with
some input in this matter before I start electroplating.
So far I'm planing to use a sulfite based Au-electrolyte since  CN-based
electrolytes might not be good with photoresists. The question  mark here is how
the Cu behaves in such a solution and if it might  dissolve in the Sulfite
electrolyte etc....or if another solution might be  better....

I would appreciate any comments in that matter!

Regards,

sebastian