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MEMSnet Home: MEMS-Talk: Polymer residual about RIE etching of SiO2 by CHF3
Polymer residual about RIE etching of SiO2 by CHF3
2008-06-19
liuxf
2008-06-20
Kvel Bergtatt
2008-06-21
Andrew Sarangan
2008-06-23
Kvel Bergtatt
2008-06-25
liuxf
Polymer residual about RIE etching of SiO2 by CHF3
Kvel Bergtatt
2008-06-23
i didn't state O2 plasma will remove the Teflon. O2 plasma will
_Oxidize_ the polymer, and then a wet clean (basic preferred) will
help removing any dry etch-remaining stuff.

just to clarify.

On 6/20/08, Andrew Sarangan  wrote:
> It is unlikely you will be able to entirely remove the flourocarbon
> polymer with O2 plasma. Try etching with CF4 or SF6. That should
> produce less polymer deposition.
>

--
_fm
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