Hi,

I am performing critical dry to release a parallel plate structure, which has
SiO2 as a sacrificial layer

After removing the sacrifical layer-SiO2 with BOE, then the device is
transffered to DI Water and then to Acetone in the critical dry chamber. After
performig critical dry process using Polaron-CPD 7501 tool, all the structures
are damaged (due to stiction problem).

Can anyone, suggest me the accurate process to perform critical dry.


Thanks in advance
Rama