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MEMSnet Home: MEMS-Talk: Critical Dry
Critical Dry
2008-06-26
Ramakrishna Kotha
2008-06-26
Shay Kaplan
2008-06-26
Bill Moffat
2008-06-26
Yianni Tousimis
2008-06-26
Kagan Topalli
2008-07-01
Jack Mulligan
2008-07-01
Robert Bock
2008-07-17
ilan yutsis
Critical Dry
Jack Mulligan
2008-07-01
Rama -

Since water is not miscible in acetone what is most likely happening inside
what I assume is an atmospheric dryer is the acetone vapor is leaving the
surfaces at a much faster rate leaving the water behind on the surfaces to
evaporative dry which leaves watermarks or spots which can cause striation
problems.

We have a solution for this using our proprietary vacuum process. Feel free
to write me for more information. I am careful not to put too much
information in an email that might be seen as using the discussion board for
commercial purposes.

Thanks.

Jack Mulligan
HyperFlo
[email protected]


-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Ramakrishna Kotha
Sent: Thursday, June 26, 2008 12:34 AM
To: [email protected]
Subject: [mems-talk] Critical Dry

Hi,

I am performing critical dry to release a parallel plate structure, which
has SiO2 as a sacrificial layer

After removing the sacrifical layer-SiO2 with BOE, then the device is
transffered to DI Water and then to Acetone in the critical dry chamber.
After performig critical dry process using Polaron-CPD 7501 tool, all the
structures are damaged (due to stiction problem).

Can anyone, suggest me the accurate process to perform critical dry.

Thanks in advance
Rama
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