In our structure, we electroplate Ni on Au substrate. Our process has Alkaline
clean, another step of activation, Ni strike, then Ni plating. For our
application, the adhesion of the plated Ni to Au film is very important. Can we
replace the Ni strike with Au strike, or insert a Au strike before Ni strike to
improve adhesion? Your help would be greatly appreciated.
With kind regards,
Qi Luo