Please see the following references:

Kim, B. and Cho, D., "Aqueous KOH Etching of (110) Silicon - Etch
Characteristics and Compensation Methods for Convex Corners", J. of
Electrochemical Society, vol. 145, no. 7, pp. 2499-2508, July 1998.

±èº´¿í, ÇѾƸ§, ÀÌ»ó¿ì, Á¶µ¿ÀÏ, ÀÌÈ£ÁØ, Á¶±¤Çö, "(110) ½Ç¸®ÄÜÀÇ ¸ðÅüÀÌ º¸»ó ¹×
À̸¦ ÀÌ¿ëÇÑ °¡¼Óµµ°è °¨ÁöºÎ ±¸Á¶¹°ÀÇ Á¦ÀÛ", ´ëÇÑÀü±âÇÐȸ³í¹®Áö, Á¦46±Ç, Á¦10È£,
pp. 1546-1556, 1997. 10.

Dong-il Dan Cho, Ph. D.
Associate Professor
School of Electrical Engineering
Seoul National University
Kwanak-ku, Shinlim-dong
Seoul 151-742, KOREA

T: 82 2 880 8371
F: 82 2 877 9304
E: [email protected]

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> Dear MEMS
> I have worked (110) silicon wafer KOH etching  verticaly for
>acceleration sensor.
>  But vertical KOH etching was not conformed. I want to know the
>method for  vertical KOH etching.
>  I wish your advices and good informastions.
> Thanks for reading my e-mail.
>email adress; [email protected]
>
>