Hi Garrett Oakes,

I'm using 7.25" pellicle on PE maskplate for 6" wafer.
The exposure energy varies from 190, 220 to 380MJ with the % clear area (non-
chrome area of the plate) of ~60, ~70 & ~2% respectively.
Data collected show that pellicle with 220mJ/70% active clear process tends to
break more frequently than the other two.
Normally my pellicles will break by itself in burst-out manner halfway during
exposure or even sitting in the storage rack.
I suspect temperature and humidity (and it's fluctuation) are the main
contributors to pellicle breakage,
but there is no opportunity for me to study. Is there any study done to check
the correlation between temperature/humidity and pellicle breakage?

Thanks,
Muk