Hello all,

I was doing some research of bonding two initially aligned Si pieces.
A homemade thermal bonder has been used, which can provide force
and heat the samples. However, due to the shear force generated by
the bonder head on the samples, the initial alignment was broken
during the bonding. Is there any way that I can reduce the shear force
to avoid breaking the alignment? Any suggestion is appreciated.

Thanks,
Lin