Hi Balaji,

Thanks. Do you think if applying some soft material on the substrates of both
samples can help in this case?

Lin

On Tue, Sep 2, 2008 at 11:23 PM, Balaji  wrote:
> Hello Lin
>
> You could try to use a graphite or a metal plate of say 2 inch dia and 2mm
> thick. This type of arrangement is there in EVG bonding machine.
>
> Balaji
>
> On Wed, Sep 3, 2008 at 1:28 AM, Lin Yu  wrote:
>
>> Hello all,
>>
>> I was doing some research of bonding two initially aligned Si pieces.
>> A homemade thermal bonder has been used, which can provide force
>> and heat the samples. However, due to the shear force generated by
>> the bonder head on the samples, the initial alignment was broken
>> during the bonding. Is there any way that I can reduce the shear force
>> to avoid breaking the alignment? Any suggestion is appreciated.