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MEMSnet Home: MEMS-Talk: Positive Resist Development Mechanism
Positive Resist Development Mechanism
2008-09-02
[email protected]
2008-09-03
Brad Cantos
2008-09-04
Richard B. Keithley
2008-09-04
[email protected]
2008-09-03
Shay Kaplan
2008-09-03
[email protected]
2008-09-03
Bill Moffat
2008-09-04
[email protected]
2008-09-04
Brad Cantos
Positive Resist Development Mechanism
Bill Moffat
2008-09-03
The input from Brad Cantos and Shay Kaplan on this question is pretty
complete.  If you want to test plasma for descum or strip let me know.
 Bill Moffat, CEO
Yield Engineering Systems, Inc.
203-A Lawrence Drive, Livermore, CA  94551-5152
(925) 373-8353

www.yieldengineering.com

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of [email protected]
Sent: Tuesday, September 02, 2008 3:45 PM
To: General MEMS discussion
Subject: [mems-talk] Positive Resist Development Mechanism

      I did some research on positive resist development but could not
find any literature that shows what the development mechanism is of the
indene-carboxylic acid photoproduct.  Am I to assume that it's a
straight redox reaction (we use NaOH for our developer) producing a
soluble salt by-product and water?

      On a related note, I am trying to develop a flood expose and
develop strip system to remove photoresist (using a mercury arc lamp as
an exposure source and our current developer to strip).  It worked well
in the initial stages, but now we are getting some residue which seems
to be a result of the photoresist being affected by other wet processes
involving permanganate and/or iodine.  Would increasing NaOH
concenration help dissolve the resist?  Your thoughts are appreciated.
reply
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