Hello,

In here we do have a Cup Plater for Cu plating (Rohm&Haas chemicals).
The most important issues for a good uniformity are:
- flow
- current density
- wafer lay-out
- temp.

If everything is well controlled we obtain an uniformity better than 5% (over a
6" wafer) with app. 15 µm Cu thickness.

Peter Kuijpers
MiPlaza
Technology Laboratories
High Tech Campus 04
Room: WAGp5-11
5656 AE Eindhoven
The Netherlands
Phone.: (+31 40 27) 43667
mobile:(+31) 06-12507027
fax.: [+31 40 27) 44769
mailto:[email protected]
________________________________________
Van: [email protected] [[email protected]] namens Denis
Petrov [[email protected]]
Verzonden: dinsdag 18 november 2008 12:42
Aan: General MEMS discussion
Onderwerp: [mems-talk] Cu electroplating uniformity problem

Hello dear MEMS-Talk members!

We are trying to electroplate 20-um thick copper over patterned 4-inch wafers.
The problem is the uniformity of the Cu layer. If it is approx. 20 um
in the middle of the wafer then we have something like 25 um at the
edges.

I found out that there is a device called an IBM Paddle Cell. Does
anybody know anything about it? Is it of help in this case? Is there
any other practical solution.
We tried the rotating cathode method and we tried to agitate the
solution with the rotating paddle. Did not help.