Please suggest the standard method of removing the oxide form on the Cr
layer after sputtering.

Normally, we directly spin coat resist after sputtering of the Cr on
glass/Si wafer (without dehydration of Cr layer as it causes for the Cr
oxide formation).

What should be the Cr sample preparation before lithography.

Thank you,

Nagare Gajanan D
IIT Bombay,Powai.
Mumbai-400 076.
INDIA