Dear James Paul Grant,

For any good liftoff the ratio of PR to the metal should be 2.5:1
And physical evaporating equipment like sputter should be considered for
depositing as it forms conformal layers.
With E beam evaporators planar layers will be formed and its hard to make a
liftoff with such a small ratio 1.3 : 1


Kallempudi Sreenivasa Saravan
PhD student, Electronics Engineering