Yinyan,

Great discussion! Can you tell me which substrate you are using to deposit
Ti/Pt? I am having similar problems.

Thanks,

Evelyn

On Tue, Jan 20, 2009 at 4:46 AM, Yinyan Gong wrote:

> Dear Edward,
>
> Thanks for your help. I have deposited Ti followed by Au (sputtering
> system) on the same substrate and did not have any problem. It seems that
> the poor adhesion does not due to contamination from cleaning process. I
> will check whether that is because of system contamination. I am just
> wondering could that be posssible that Cr or Pt does not have good adhesion
> to my substrates which are boron compounds and do not have excellent
> crystalline quality? Thank you very much.
>
> Yinyan

EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851
Email: [email protected]