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MEMSnet Home: MEMS-Talk: glass cracking during anodic bonding
glass cracking during anodic bonding
2009-02-26
jingru zhang
2009-02-26
Mehmet Aykol
2009-02-26
jingru zhang
2009-02-27
shay kaplan
2009-02-27
jingru zhang
2009-02-28
shay kaplan
2009-02-27
Staller, Steven E
2009-02-27
jingru zhang
2009-02-27
Brad Johnson
2009-02-27
jingru zhang
2009-03-02
Brad Johnson
2009-03-03
jingru zhang
2009-03-04
Brad Johnson
glass cracking during anodic bonding
jingru zhang
2009-02-26
Hi Mehmet,

Where did you order the previous Pyrex 7740 and how thick is it?

On Thu, Feb 26, 2009 at 12:48 PM, Mehmet Aykol wrote:

> I had the same problem. I am using Pyrex 7740 blend or at least the vendor
> claims so. I have checked the thermal expansion coeff. of Si and Pyrex and
> they are almost the same. I concluded that either the batch of Pyrex was
> bad
> (because bonding process was going fine with previous batches) or Pyrex
> wafer was thin and it couldn't take the stress after the sample cooled
> down. Although I am also curious if this can be avoided.
>
> Mehmet

--
Jingru
reply
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