If the wider channel tend to crack more the cracking might be a result of
stress due to the air pressure on the glass due to the partial vacuum inside
after cooling.

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of jingru zhang
Sent: Friday, February 27, 2009 4:47 PM
To: General MEMS discussion
Subject: Re: [mems-talk] glass cracking during anodic bonding

I have different dimensions. For example, the width of the channel is 200
microns, and the depth is 100 microns.