Hi all,
and thanks in advance for the suggestions...do you think that is possible to
bypass the problem making the Post bake in a vacuum oven in order to
eliminate the outgassing of the uncrosslinked SU-8?What do you if instead
of Cr i try to deposit the Ti?

Andrea Lucibello
----- Original Message -----
From: "Aniruddh Sarkar" 
To: 
Sent: Wednesday, March 18, 2009 1:55 AM
Subject: Re: [mems-talk] Uncured SU-8 crack


Hi,

I have tried this before and though I did not finally get it to work (found
a way to bypass this step) but I remember seeing a reference (sorry not able
to find it now) that claimed this problem was because of a thermal expansion
coefficient mismatch. They put the wafer on a thermoelectric cooler and held
the temperature constant during the deposition and it worked just fine!

I am not sure whether its worth the effort of fitting the TEC inside the
vacuum system - but for what its worth this is what I remember reading.

--
Good luck,
Aniruddh