Hi all!

I've been trying to bond two pdms devices using an oxygen plasma source.

It seems that the plasma system can effectively bond two untreated pdms slabs,
but the problem is...

I have to coat my patterned wafer with silane as it has small pit/trench
features.

After slicing up my pdms slabs, I immediately tried bonding these two slabs
together but without success.

The plasma system has no problem in bonding two untreated pdms slabs, so I
anticipate that the silane has rendered the pdms hydrophobic, leading to a
failure in bonding.

Is there a way to remove the silane coated pdms, after peeling it off from my
wafer, to enhance the bonding strength?

Thank you!

Best,

TJ