Greetings all.

We are running into difficulties with the adhesion of 1813 PR to gold.
We never experienced this problem before.

In the past we used AP 100 series from Silicon resources however they no longer
seem to be in business.

We now use recommended omnicoat sold through micro chem,
I t works well.

The problem is once we develop /etch the PR, blotches of the omnicoat remain.
We cure the omnicoat at 200 degrees C.

70 percent of the wafer looks perfect the rest we cannot remove the omnicoat.
Questing what chemical can we use to remove the Omnicoat without affecting the
remaining PR pattern.

I am sure that someone has the answers out there in cyberspace.

Thanking you in advance

Zoltan