To all,

I am trying to figure out what e-beam, sputtering, and thermal evaporation
metal deposition profiles look like.  I read in Coventorware that the
e-beam's profile is supposed to be conformal but I have heard otherwise from
other sources.  Does anyone have cross sectional views/pictures of a
Substrate/Negative Resist/Metal deposited using either of these methods?  I
am mostly interested in seeing what the wall coverage looks like.  It would
be greatly appreciated.

--
EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851