Dear Evelyn,

For lift off the best suited one is sputter deposition and it is the one which
makes an conformal layer.

The coverage depends on the type of PR you are going to use. In order to perform
a successful liftoff using image reversal process, the thickness of PR should be
atleast 2 times of the metal thickness.

--Saravan

I am trying to figure out what e-beam, sputtering, and thermal evaporation
metal deposition profiles look like.  I read in Coventorware that the
e-beam's profile is supposed to be conformal but I have heard otherwise from
other sources.  Does anyone have cross sectional views/pictures of a
Substrate/Negative Resist/Metal deposited using either of these methods?  I
am mostly interested in seeing what the wall coverage looks like.  It would
be greatly appreciated.

--
EVELYN BENABE