Dear Folks,

Recently I am working on Ti/Au metals on polyimides and find adhesion
is not as good as wanted although surface treatment such as plasma
clean before metal sputtering is applied. After bending the strips for
certain times, the metal layer tends to peel off from polyimide.
Is there any other surface treatment I can try? or Could anybody
kindly give me a direction on how to design release stress in this
bilayer structure?

Any help would very appreciated.

Thanks.

Chris