Hi Denis,

   I would look into technologies called HTCC and LTCC.  They have exactly what
you need.

Phil

> Date: Wed, 6 May 2009 16:46:22 +0200
> From: [email protected]
> To: [email protected]
> Subject: [mems-talk] Metallized vias in ceramic (and silicon) wafers
>
> Hello,
>
> I am looking for a solution to make metallised vias (approx. 100 µm in
> diameter) through a 500 µm thick 4-inch ceramic wafer.
>
> The surface must then be planarized to be used in subsequent MEMS-processing
> steps. So, it must be a kind of a PCB on ceramics.
>
> Does anybody know a vendor or maybe a process for that.
>
> I would also be greatful in any information on how to efficiently create
> such vias in silicon.