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MEMSnet Home: MEMS-Talk: Positive sidewall, dry etch of silicon using BOSCH process
Positive sidewall, dry etch of silicon using BOSCH process
2009-05-19
shimul saha
2009-05-21
Jie Zou
2009-05-21
James Paul Grant
2009-05-21
Fei Wang
2009-05-21
[email protected]
Positive sidewall, dry etch of silicon using BOSCH process
[email protected]
2009-05-21
Hi,

If the etch is slightly undercutting you need to decrease your SF6 flow.

Dave

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of shimul saha
Sent: 19 May 2009 11:12
To: General MEMS discussion
Subject: [mems-talk] Positive sidewall,dry etch of silicon using BOSCH process

Hello,

I am using BOSCH process for deep dry etching of silicon. The gases are SF6, O2
during etching cycles and C4F8 during deposition cycles.. At present I am
getting slightly negative sidewall, but I want a positive sidewall. Can you
please provide any hint, probably changing gas ratio (incerase or decrease any
of the gas content) or power to get a positive sidewall in etching. Any
suggestions will be greatly helpful for me. Thanking you in advance.

Best regards,
Shimul
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