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MEMSnet Home: MEMS-Talk: Gold adhesion to Ti oxide
Gold adhesion to Ti oxide
2009-06-19
mikas remeika
2009-06-20
ning xue
2009-06-20
Alex Mellnik
2009-06-21
Xiaoguang Liu
2009-06-21
mikas remeika
2009-06-21
Prasanna Srinivasan
2009-06-21
Pavan Samudrala
2009-06-21
Kagan Topalli
2009-06-22
Morrison, Richard H., Jr.
2009-06-22
shimul saha
2009-06-22
abhaya joshi
2009-06-22
Albert Henning
Gold adhesion to Ti oxide
Xiaoguang Liu
2009-06-21
Hi

The thickness of your metal layer can also be a problem for
wirebonding. It is more difficult to bond to a very thin layer of
gold. Try increasing the thickness of the Ti and Au.

Best
Leo

On Sat, Jun 20, 2009 at 2:14 PM, Alex Mellnik wrote:
> Hi Mikas,
>
> We have had similar problems with adhesion between Ti, Au and other
> materials that works well for liftoff, but generally does not survive
> wirebonding.  What other materials do you have in your e-beam system?  I'm
> surprised that the Ti did not work, but aluminum or chrome might also be
> worth a shot.  Finally, is the substrate treated any after the oxygen
> plasma?  A mild acid etch, if possible, might work.
>
> -Alex

Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
[email protected]
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