Pradeep, use Nickel as the adhesion layer.  Electroplate and sinter in.
Woods nickel strike, sulfamate nickel plate.  Gary

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of mikas remeika
Sent: Monday, June 29, 2009 3:41 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Oxidation of Molybdenum


Here's a website that has a lot of info on etching recipes:
http://www.ee.byu.edu/cleanroom/wet_etch.phtml

On Mon, Jun 29, 2009 at 1:26 AM, Pradeep Dixit wrote:
> Hello Everyone,
>
> I would like to check something with you:
>
> 1. Has any one tried to electroplate copper on a Molybdenum seed layer ?
>
> 2. I think, Molybdenum oxidizes easily.  Does anyone have an idea on how
> to remove Molybdenum oxide ? wet etching or dry plasma etching?