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MEMSnet Home: MEMS-Talk: Correct way of doing Lift-off process
Correct way of doing Lift-off process
2009-07-14
Shah, Forum N
2009-07-14
Dongxiao Li
2009-07-14
Jauniskis, Linas
2009-07-14
mikas remeika
2009-07-14
ANIRBAN SARKAR
2009-07-14
mikas remeika
2009-07-15
basar bolukbas
2009-07-16
Bill Moffat
2009-07-14
Reza Rashidi
Correct way of doing Lift-off process
Bill Moffat
2009-07-16
Agree with below.  Image Reversal gives reverse angle of resist.  Up to
-22 degrees which ensures complete lift off.  Contact me for technical
papers and free tests Bill Moffat

________________________________

From: [email protected] on behalf of basar bolukbas
Sent: Wed 7/15/2009 1:06 AM
To: mems litho
Subject: Re: [mems-talk] Correct way of doing Lift-off process


Hi Anirban,

Is there any special reason that you dont use image reversal
lithography?

If you have a step gives to same pattern with image reversal
lithography, I recommend you use this step.

Beacuse you will have a clear under cut with image reversal then you
will be able to lift-off your patterns.

With your current process, you have thick resist but the profile of
resist is positive due to direct lithography.

This gives you continuous metal deposition profile which prevents to
good lift-off.

Best Regards.
reply
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