Dear cfshen,

In my opinion your deposition rate is to high which may yield to the formation
of those particles.
You can try to lower the evaporation rate up to 0.5A/s and if needed cooling the
sample to obtain more uniform film.

Regards,

RH

> Date: Thu, 30 Jul 2009 07:39:44 +0800
> From: [email protected]
> To: [email protected]
> Subject: [mems-talk] question about ebeam evaportation of metals
>
> Dear all,
>
> I'm using ebeam evaporation to deposit Ti and Al. Both films have dense
> particles observed under microscope. The evporation rates are controlled to
> be 4A/s. The wafers were thoroughly cleaned.
>
> What are the reasons that forms the particles? How to solve this problem?
>
> Thank you very much for your suggestions.
>
> cfshen