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MEMSnet Home: MEMS-Talk: peeling of AZ5214E
peeling of AZ5214E
2009-08-13
renil kumar
2009-08-13
Jordi Teva
2009-08-13
Jun Huang
2009-08-13
Wilson, Thomas
2009-08-14
Shao Guocheng
2009-08-14
renil kumar
2009-08-14
[email protected]
peeling of AZ5214E
[email protected]
2009-08-14
Hello.

what is your recipe to deposit HDMS? Just by spin-coating, which is the
easiest way? I read that usually the thickness is too big when using a
spin-coater, so that alternatively, evaporation in an oven may be used.

Best regards,
Daniel

***************************************************************
* Dr. Daniel Grimm
* IFW Dresden
*            - Institute for Integrative Nanosciences -
***************************************************************


-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Wilson, Thomas
Sent: Donnerstag, 13. August 2009 20:08
To: General MEMS discussion
Subject: Re: [mems-talk] peeling of AZ5214E

Hi Renil,

In case you're already using HDMS prior to spinning your photoresist, I
would then suspect the cleanliness of your surfaces. A piranha clean (more
involved and dangerous in my opinion) or Summa-Clean (very easy) should help
solve your subsequent adhesion problems (AZ5214E) during
photolithography/liftoff - A piranha dip once solved an adhesion problem for
me that was only noticed for my silicon chips (originally clean) that were
stored in plastic chip cases for some months.


Best regards,

Thomas E. Wilson
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