Hi all,
I am also trying to find a good way to do wafer bonding with thick
layer like 60um. Is that possible for SU-8 or BCB?
Thanks a lot!
2009/8/13, Kuijpers, Peter :
> Hello,
>
> You can use Dry etch BCB (3000-serie.
> Inhere we use it for W2W bonding.
>
> Regards,
>
> Peter Kuijpers
--
Best regards,
Yours sincerely
Fei Wang
______________
Postdoctoral researcher, Dr
MIC - Department of Micro and Nanotechnology
Technical University of Denmark (DTU)
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