Hi Gudrun,

how thick is this layer you want to deposit?

If it is a very thin layer for small structures you would better use the CVD
method. For thicker films you have to use the PVD method but starting a certain
thickness you often get the problem of peeling or cracking of the film...

Best regards,
Michael


-----Ursprüngliche Nachricht-----
Von: [email protected] [mailto:[email protected]] Im
Auftrag von Henn, Gudrun: Ms.
Gesendet: Dienstag, 24. November 2009 11:11
An: [email protected]; General MEMS discussion
Betreff: Re: [mems-talk] Tungsten deposition, e-beam, sputter


 Hello,

We have done both, evaporation and sputtering. Evaporated film show a bad
surface structure, due to thermal effects the layer cracks. With sputtering it
is easier to get a dense film.


Best regards
Gudrun