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MEMSnet Home: MEMS-Talk: Problems with EOT Liftoff of 1.5 um diameter holes (Au on GaAs)
Problems with EOT Liftoff of 1.5 um diameter holes (Au on GaAs)
2009-11-30
Kevin R. Anglin
2009-12-01
[email protected]
2009-12-01
Kevin R. Anglin
2009-12-01
Wilson, Thomas
2009-12-01
shay kaplan
2009-12-01
[email protected]
2009-12-01
Bill Moffat
Problems with EOT Liftoff of 1.5 um diameter holes (Au on GaAs)
Kevin R. Anglin
2009-11-30
I can't get good EOT liftoff for 1.5 um diameter hole arrays.

I'm using PR5214 spun 1.1 um thick, then deposit 50/1000 Angstroms
of Ti/Au. I use a supersonic acetone bath to liftoff, but it doesn't. I've
tried Chlorobenzene dips post-expose pre-develop, as well as varying baking
times and exposure times. Sometimes I liftoff donut shaped patterns instead
of holes.

Any suggestions would be welcomed, as I continually waste gold.
reply
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