In order to determine the problem I like to know do you sputter the
materials or E beam, and are you confident the PR does not exceed the temp
were lift of becomes problematic.

[email protected]

----- Original Message -----
From: "Kevin R. Anglin" 
To: 
Sent: Monday, November 30, 2009 2:51 PM
Subject: [mems-talk] Problems with EOT Liftoff of 1.5 um diameter holes
(Auon GaAs)


>I can't get good EOT liftoff for 1.5 um diameter hole arrays.
>
> I'm using PR5214 spun 1.1 um thick, then deposit 50/1000 Angstroms
> of Ti/Au. I use a supersonic acetone bath to liftoff, but it doesn't. I've
> tried Chlorobenzene dips post-expose pre-develop, as well as varying
> baking
> times and exposure times. Sometimes I liftoff donut shaped patterns
> instead
> of holes.
>
> Any suggestions would be welcomed, as I continually waste gold.