Problems with EOT Liftoff of 1.5 um diameter holes (Au on GaAs)
shay kaplan
2009-12-01
Are you trying to lift resist discs or leave evaporated discs?
Shay
-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Kevin R. Anglin
Sent: Tuesday, December 01, 2009 12:51 AM
To: [email protected]
Subject: [mems-talk] Problems with EOT Liftoff of 1.5 um diameter holes (Au
on GaAs)
I can't get good EOT liftoff for 1.5 um diameter hole arrays.
I'm using PR5214 spun 1.1 um thick, then deposit 50/1000 Angstroms
of Ti/Au. I use a supersonic acetone bath to liftoff, but it doesn't. I've
tried Chlorobenzene dips post-expose pre-develop, as well as varying baking
times and exposure times. Sometimes I liftoff donut shaped patterns instead
of holes.
Any suggestions would be welcomed, as I continually waste gold.