You could use a back grinding or dicing tape that is UV released or a
spray on coating that will wash off in water.


Regards,
Steven J. Adamson
Market Manager, Asymtek

IMAPS Foundation
Supporting the next generation

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of dan eliran
Sent: Thursday, January 07, 2010 4:12 AM
To: [email protected]
Subject: [mems-talk] Wafer surface protection UV tape for dicing

Dear Mems-talk members,

I'm looking for a protection tape to be use while dicing, in order to
protect the top side of the device.  This tape must peel spontaneously
after dicing and UV irrading, possibly by heat.

Does anyone use this tape or know a vendor of this tape?

Dan