Hello MEMS Community,

I would like to clean some fully processed wafers containing Al,0.5%Cu metal
layers. What would be the best method to clean such wafers ? Normally, I use
90-100% HNO3 to clean my CMOS wafers with Al,1%Si metal layers.

Can I apply the same cleaning solution for Al,0.5%Cu metal layers (or will this
attack Cu and degrade the electrical characteristics of the metal layers) ? Any
suggestion (based on experience) is deeply appreciated.

Thanks in advance,
Vijay

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Delft Institute of Microsystems & Nanoelectronics (DIMES)
Delft University of Technology (TU Delft)
The Netherlands