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We have a proprietary modified RCA clean that produces extremely clean
wafers with no residual stiction.
One MEMS customer had particles ranging in size from 1m to 5m embedded
in device structures. The particles were a mix of photoresist residue,
FeOH, and other process related junk.
A production wafer was inspected prior to running our process. 33 areas
with contamination were mapped and photographed (see attached picture).
After our process, the same 33 areas were reinspected, and 31 out of 33
areas were totally cleaned. A better than 93% removal rate with no
stiction (see attached photograph). These results were obtained in a
class 100 cleanroom, with particle counts near our tool being 100-500
particles (0.5m) per minute
On bare silicon wafers, our process cleans wafers with greater than
30,000 particles at .16m down to under 50. These results were obtained
in a class 10 cleanroom
These results have been duplicated at another MEMS customer site.
If interested, please contact
Rajiv Bhushan
YieldUP international
117 Easy Street
Mountain View, CA 94043
Ph: (650) 964-0100
[email protected]
< [email protected]> wrote:
Someone mentioned a solution used to clean off Organic
contaminants called RCA Etch or something similar. It was
developed in the 70's or earlier, but I can't find any
literature on it. I believe that it contains H2O2 and H2SO4
but I don't know in what proportions. If anyone can help me
out, I'd appreciate it. We're having some problems with
"sticking" of our capacitive accelerometers and want to
eliminate the possibility of organic contaminants. Any
suggestions would be appreciated.
Thanks.
Jason Tauscher
[email protected]
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We have a proprietary modified RCA clean that produces extremely clean
wafers with no residual stiction.
One MEMS customer had particles ranging in size from 1m
to 5m embedded in device structures. The
particles were a mix of photoresist residue, FeOH, and other process related
junk.
A production wafer was inspected prior to running our process. 33 areas
with contamination were mapped and photographed (see attached picture).
After our process, the same 33 areas were reinspected, and 31 out of 33
areas were totally cleaned. A better than 93% removal rate with no
stiction (see attached photograph). These results were obtained in
a class 100 cleanroom, with particle counts near our tool being 100-500
particles (0.5m) per minute
On bare silicon wafers, our process cleans wafers with greater than
30,000 particles at .16m down to under 50.
These results were obtained in a class 10 cleanroom
These results have been duplicated at another MEMS customer site.
If interested, please contact
Rajiv Bhushan
YieldUP international
117 Easy Street
Mountain View, CA 94043
Ph: (650) 964-0100
[email protected]
Someone mentioned a solution used to clean off Organic contaminants
called RCA Etch or something similar. It was developed in the 70's
or earlier, but I can't find any literature on it. I believe that
it contains H2O2 and H2SO4 but I don't know in what proportions.
If anyone can help me out, I'd appreciate it. We're having
some problems with "sticking" of our capacitive accelerometers and want
to eliminate the possibility of organic contaminants. Any suggestions
would be appreciated.
