Hi Joe,

You can use ~15nm of Ti as a good adhesion.
Ti is an excellent adhesion layer for Cu electroplating.

Ed


On Mon, Aug 16, 2010 at 2:26 PM,  wrote:

> Hi everyone,
>
>       I'm working on Cu electroplating to fabricate Cu pad. The 200nm Cu
> seed layer is directly sputtered on the silicon dioxide without using
> adhesion layer. After about 4 um Cu is electroplated, the Cu is not adhered
> to the substrate well, and can peel off very easily. My question is, what
> kind of material can be used as the adhesion promotion layer. We have Al,
> Ti, Ag and Ni in our lab, and will these metals can act as the adhesion
> promotion layer? If not, what kind of material can be used and can be
> readily removed after the electroplating. Thanks.
>
> Joe